采用超高真空化学沉积法在In0.51Ga0.49P/GaAs和GaAs衬底上生长出高质量的锗外延薄膜

Y. Su, Shih-Hsuan Tang, C. Nguyen, Ching-Wen Kuan, H. Yu, E. Chang
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引用次数: 0

摘要

采用超高真空化学气相沉积(UHVCVD)系统在不同材料In0.51Ga0.49P和GaAs上外延生长高质量Ge薄膜。通过x射线衍射(XRD)和透射电镜(TEM)证实了在In0.51Ga0.49P和GaAs层上形成的高质量Ge层的结晶度。用原子力显微镜(AFM)分析了在In0.51Ga0.49P和GaAs上生长的Ge的表面形貌。Ge在GaAs上的粗糙度优于In0.51Ga0.49P。这两种结构都是为了制造p沟道金属氧化物半导体场效应晶体管(MOSFET)而设计的,用于集成Ge p沟道器件和III-V n沟道电子器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High quality Ge epitaxial films grown on In0.51Ga0.49P/GaAs and GaAs substrates by ultra high vacuum chemical deposition
The epitaxial growth of high quality Ge thin films on different materials of In0.51Ga0.49P and GaAs by ultra high vacuum chemical vapor deposition (UHVCVD) system was studied. The crystallinity of high quality Ge layers on In0.51Ga0.49P and GaAs layers can be proved by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The comparison of surface morphology between Ge grown on In0.51Ga0.49P and GaAs was also analyzed by atomic force microscopy (AFM). The roughness of Ge on GaAs shows better than that of In0.51Ga0.49P. Both of these structures were designed for fabricating p-channel metal-oxide-semiconductor field-effect transistor (MOSFET) for the integration of Ge p-channel device with III-V n-channel electronic device.
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