焊料棒——用于大功率器件的新型倒装芯片

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853234

P. Elenius, H. Yang, R. Benson

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引用次数: 3

摘要

传统倒装芯片技术在高功率/大电流应用中的兼容性可能会在器件工作寿命期间出现功能和可靠性问题。当在给定结温下暴露于高电流密度时，典型的倒装芯片焊点可能会由于电迁移而早期失效。作为一种可行的替代方案，开发了焊料棒方法，通过降低电流密度和提高器件的使用寿命来增加焊点的横截面积。

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Solder bars-a novel flip chip application for high power devices

The compatibility of conventional flip chip technology for high power/high current applications can present functional and reliability issues during the device operating life. Typical flip chip solder bumps can experience early failures due to electromigration when exposed to a high current density at a given junction temperature. As a viable alternative, the solder bar approach was developed to increase the cross-sectional area of the solder joint, there by reducing current density and improving device operating life.

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2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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