外延封装谐振加速度计与片上微型烤箱

D. D. Shin, Yunhan Chen, I. Flader, T. Kenny
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引用次数: 20

摘要

本文首次报道了一种外延封装谐振加速度计的片上烘烤,以提高比例因子和偏置的稳定性。双端音叉(DETF)谐振器与感应谐振器共享锚点,用于测量设备温度。使用封装层中定义的片上硅加热器将测量温度维持在固定设定点。初步结果表明,该器件除了固有的无源温度补偿外,还有显著的改进。在−20°C至80°C的温度范围内,0g偏置误差减少了三倍,比例因子稳定性提高了一个数量级以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Epitaxially encapsulated resonant accelerometer with an on-chip micro-oven
This paper reports, for the first time, on-chip ovenization of an epitaxially encapsulated resonant accelerometer to improve the stability of scale factor and bias. A double-ended tuning fork (DETF) resonator that shares the anchor with the sensing resonators is used to measure the device temperature. The measured temperature is maintained at a fixed set point using an on-chip silicon heater defined in the encapsulation layer. Preliminary results show significant improvement beyond the device's intrinsic passive temperature compensation. Over the temperature range from −20°C to 80°C, the 0g bias error is reduced by a factor of three, and the scale factor stability is improved by over an order of magnitude.
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