深亚微米mosfet的SPICE建模

G. Angelov, M. Hristov
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引用次数: 8

摘要

随着主流MOS技术向纳米尺度扩展,开发涵盖几何、偏置、温度、直流、交流、射频和噪声特性的电路仿真物理模型和预测模型成为一个主要目标。本文讨论了缩放,趋势及其限制因素,并遵循SPICE的三个MOSFET模型世代的演变:从伯克利级1,2,3到最新的BSIM3v3, BSIM4, MM11, EKV和SP2001。研究了MOSFET模型,强调了数值计算的器件物理和数学技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SPICE modeling of MOSFETs in deep submicron
As the mainstream MOS technology is scaling into nanometer sizes, the development of physical and predictive models for circuit simulation that cover geometry, bias, temperature, DC, AC, RF, and noise characteristics becomes a major goal. The paper addresses the scaling, trends and their limiting factors and follows through the evolution of the three MOSFET model generations of SPICE: from the Berkeley Levels 1, 2, 3 to the latest BSIM3v3, BSIM4, MM11, EKV, and SP2001. MOSFET models are examined, emphasizing device physics and mathematical techniques for numerical calculation.
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