工艺过程对厚膜层性能和可靠性的影响

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI:10.1109/ISSE.2004.1490444

I. Pelikánová, T. Konupka

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引用次数: 1

摘要

厚膜层及其性能是本文研究的主题。关注厚膜电阻器，特别是它们在修剪过程中的行为。对两种修边方法的影响进行了研究和比较。一些样品用铣刀修剪，其他样品用激光修剪。测量了电阻的变化和C-V特性的非线性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The influence of technological process on properties and reliability of thick film layers

Thick film layers, and their properties, are the topic of this paper. Attention is paid to thick film resistors and particularly their behavior in connection with the trimming process. The influence of two methods of trimming was investigated and compared. Some samples were trimmed by a milling cutter and other samples were trimmed by laser. The change of resistance and non linearity of C-V characteristics were measured.

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27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.

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