{"title":"零插入力插座的有限元振动分析","authors":"K. Chiang, Hsueh-Horng Fu","doi":"10.1115/imece1996-0893","DOIUrl":null,"url":null,"abstract":"\n In this research, a vibration analysis using finite element method with specific application to CHIP, LCP socket and PCB packaging are studied. The sensitivity of the design and material parameters of the whole CPU connector system is studied by two different approaches. A coarse finite element model is established to investigate the effects of vibration modes of the boundary condition parameters, and a detailed finite element model is adopted to evaluate the influence of the different types of boundary constrains to the whole system.","PeriodicalId":375055,"journal":{"name":"Sensing, Modeling and Simulation in Emerging Electronic Packaging","volume":"162 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Finite Element Vibration Analysis for Zero Inserting Force Socket\",\"authors\":\"K. Chiang, Hsueh-Horng Fu\",\"doi\":\"10.1115/imece1996-0893\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n In this research, a vibration analysis using finite element method with specific application to CHIP, LCP socket and PCB packaging are studied. The sensitivity of the design and material parameters of the whole CPU connector system is studied by two different approaches. A coarse finite element model is established to investigate the effects of vibration modes of the boundary condition parameters, and a detailed finite element model is adopted to evaluate the influence of the different types of boundary constrains to the whole system.\",\"PeriodicalId\":375055,\"journal\":{\"name\":\"Sensing, Modeling and Simulation in Emerging Electronic Packaging\",\"volume\":\"162 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensing, Modeling and Simulation in Emerging Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1996-0893\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensing, Modeling and Simulation in Emerging Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1996-0893","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Finite Element Vibration Analysis for Zero Inserting Force Socket
In this research, a vibration analysis using finite element method with specific application to CHIP, LCP socket and PCB packaging are studied. The sensitivity of the design and material parameters of the whole CPU connector system is studied by two different approaches. A coarse finite element model is established to investigate the effects of vibration modes of the boundary condition parameters, and a detailed finite element model is adopted to evaluate the influence of the different types of boundary constrains to the whole system.
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