eeprom的现状、未来与标准化

1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers Pub Date : 1900-01-01 DOI:10.1109/ISSCC.1984.1156612

A. Lancaster, P. Salsbury

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引用次数: 0

摘要

大比特密度eeprom正从多个供应商那里变得可用。这些设备的结构基于许多不同的技术，并提供许多不同的功能。潜在用户面临着许多艰难的选择。小组成员将讨论这种方法的概况，每种方法的相对优点，并解决标准化问题。

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Status, future and standardization of EEPROMs

Large bit density EEPROMs are becoming available from multiple vendors. The structures of these devices are based on many diverse technologies, and provide many different features. Potential users are faced with many difficult choices. Panelists will discuss this profileration of approaches, the relative merits of each and address the standardization problem.

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来源期刊

1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers

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