封装和PCB仿真中的电感耦合插值效应

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2017-10-01 DOI:10.1109/EPEPS.2017.8329744

Xin Xu, W. Thiel, J. Bracken

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引用次数: 0

摘要

提出了一个简单的插值公式来模拟平行板和带状线模式之间的频率相关电感耦合效应。它只需要传输线的直流和高频结果。与一般的宽带二维全波模拟算法(如FEM或MOM)相比，这些结果可以更有效地获得。数值试验表明，该方法与二维全波模拟结果吻合较好

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Interpolating inductance coupling effects for package and PCB simulation

A simple interpolating formula is proposed to model the frequency dependent inductance coupling effect between parallel plate and stripline modes. It requires only DC and high-frequency results of a transmission line. These results can be obtained more efficiently as compared to a general wide band 2D full wave simulation algorithm such as FEM or MOM. Numerical tests show that the proposed method agrees reasonably well with 2D full wave simulation

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来源期刊

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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