{"title":"加速度计双面曝光及粘接技术","authors":"Taiping Zhang, Ting Li, Ke-Qiang Deng","doi":"10.1109/ICSICT.1998.786524","DOIUrl":null,"url":null,"abstract":"The authors use double sided exposure and bonding and deep etching to fabricate accelerometers and gyroscopes. The technology is based on MEMS processing. The sensor testing is presented.","PeriodicalId":286980,"journal":{"name":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Technology of double side exposure and bonding for fabrication of accelerometer\",\"authors\":\"Taiping Zhang, Ting Li, Ke-Qiang Deng\",\"doi\":\"10.1109/ICSICT.1998.786524\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors use double sided exposure and bonding and deep etching to fabricate accelerometers and gyroscopes. The technology is based on MEMS processing. The sensor testing is presented.\",\"PeriodicalId\":286980,\"journal\":{\"name\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.1998.786524\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.1998.786524","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Technology of double side exposure and bonding for fabrication of accelerometer
The authors use double sided exposure and bonding and deep etching to fabricate accelerometers and gyroscopes. The technology is based on MEMS processing. The sensor testing is presented.