{"title":"高度集成的超紧凑射频收发模块,用于无线数据和电话应用","authors":"M. Guruprasad, D. Chow","doi":"10.1109/ISCE.1997.658396","DOIUrl":null,"url":null,"abstract":"This paper describes an ultra compact DECT RF module using highly integrated concept developed by Philips. The module architecture, performance and specific advantages are presented. This state of the art module meets the most stringent requirements of DECT wireless applications.","PeriodicalId":393861,"journal":{"name":"ISCE '97. Proceedings of 1997 IEEE International Symposium on Consumer Electronics (Cat. No.97TH8348)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1997-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Highly integrated ultra compact RF transceiver module for wireless data and telephone applications\",\"authors\":\"M. Guruprasad, D. Chow\",\"doi\":\"10.1109/ISCE.1997.658396\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes an ultra compact DECT RF module using highly integrated concept developed by Philips. The module architecture, performance and specific advantages are presented. This state of the art module meets the most stringent requirements of DECT wireless applications.\",\"PeriodicalId\":393861,\"journal\":{\"name\":\"ISCE '97. Proceedings of 1997 IEEE International Symposium on Consumer Electronics (Cat. No.97TH8348)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ISCE '97. Proceedings of 1997 IEEE International Symposium on Consumer Electronics (Cat. No.97TH8348)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISCE.1997.658396\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISCE '97. Proceedings of 1997 IEEE International Symposium on Consumer Electronics (Cat. No.97TH8348)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISCE.1997.658396","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Highly integrated ultra compact RF transceiver module for wireless data and telephone applications
This paper describes an ultra compact DECT RF module using highly integrated concept developed by Philips. The module architecture, performance and specific advantages are presented. This state of the art module meets the most stringent requirements of DECT wireless applications.