{"title":"在硅晶圆厂中启用玻璃晶圆","authors":"Jay Zhang, Chee-Hau Ng, S. Kouassi","doi":"10.1109/asmc54647.2022.9792475","DOIUrl":null,"url":null,"abstract":"Glass has unique properties that makes it attractive for certain applications, such as transparency for optical components and low nonlinearity for RF. The Si industry has created highly sophisticated process capabilities in terms of feature size and high precision, among other features. Combining the two creates new possibilities not only in device performance, but also scale economies. This paper discusses challenges in using glass in a Si fab and how to overcome these challenges.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Enabling Glass Wafers in a Si Fab\",\"authors\":\"Jay Zhang, Chee-Hau Ng, S. Kouassi\",\"doi\":\"10.1109/asmc54647.2022.9792475\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Glass has unique properties that makes it attractive for certain applications, such as transparency for optical components and low nonlinearity for RF. The Si industry has created highly sophisticated process capabilities in terms of feature size and high precision, among other features. Combining the two creates new possibilities not only in device performance, but also scale economies. This paper discusses challenges in using glass in a Si fab and how to overcome these challenges.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792475\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Glass has unique properties that makes it attractive for certain applications, such as transparency for optical components and low nonlinearity for RF. The Si industry has created highly sophisticated process capabilities in terms of feature size and high precision, among other features. Combining the two creates new possibilities not only in device performance, but also scale economies. This paper discusses challenges in using glass in a Si fab and how to overcome these challenges.
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