R. Masuyama, H. Yagi, N. Inoue, Y. Onishi, T. Katsuyama, T. Kikuchi, Y. Yoneda, H. Shoji
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引用次数: 10
摘要
我们已经展示了使用3英寸直径晶圆工艺的基于inp的波导光电二极管(wgpd)与金属-绝缘体-金属(MIM)电容器的单片集成。MIM电容的均匀性在+/- 2%以内,电容的介电击穿电压在100 V以上。由于在WGPD表面形成了InP钝化结构,在反向电压为1.6 V时,WGPD的暗电流小于3 nA。所制集成芯片尺寸为2.0 mm × 5.1 mm。这些结果表明,集成wgpd可以为紧凑型相干接收机提供更小、更容易的组装。
Monolithic integration of InP-based waveguide photodiodes with MIM capacitors for compact coherent receiver
We have demonstrated monolithic integration of InP-based waveguide photodiodes (WGPDs) with metal-insulator-metal (MIM) capacitors using the 3-inch diameter wafer process. The uniformity of MIM capacitance and the dielectric breakdown voltage of the capacitor obtained within +/-2 % and over 100 V, respectively. The dark current of WGPDs was less than 3 nA at a reverse voltage of 1.6 V, owing to the InP passivation structure formed on WGPD surface. The fabricated integrated chip size was 2.0 mm × 5.1 mm. These results indicate that integrated WGPDs can provide both smaller and easier assembly for the compact coherent receiver.