具有大通断比和高通流的掺杂WS2晶体管

A. Kumar, K. N. Nazif, P. Ramesh, K. Saraswat
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引用次数: 5

摘要

需要掺杂二维(2D)过渡金属二硫族化合物(TMDs)来调整阈值电压(V T),并通过降低通道和片电阻来增加电流驱动[1]。然而,在tmd中掺杂往往会导致场效应晶体管(fet)的通断比急剧下降[2],[3]。二硫化钨(ws2)是一种层状TMD,具有较大的带隙(在双层中> 2ev[4])。我们展示了一种稳定的n型掺杂技术,使用亚化学计量氧化铝(AlO X)[5]在剥离双层ws2晶体管中获得了最高的每层导通电流(每层80 μ a /μm),同时保持了高通断比(10 8)和低导通电流(≈5 × 10 -13 a /μm)。对这些器件进行建模后发现,它们具有较大的界面陷阱密度(1×10 13 cm 2 eV -1)和高肖特基势垒高度(SBH)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Doped WS2 transistors with large on-off ratio and high on-current
Doping of two-dimensional (2D) transition metal dichalcogenides (TMDs) is needed to adjust the threshold voltage (V T ) and to increase the current drive by reducing both the channel and sheet resistances [1] . However, doping in TMDs often results in a sharp degradation in the on-off ratio of the field-effect transistors (FETs) [2] , [3] . Tungsten disulfide (WS 2 ) is a layered TMD with a large band-gap (> 2 eV in bilayers [4] ). We show a stable n-type doping technique using sub-stoichiometric Aluminum oxide (AlO X ) [5] in exfoliated bilayer WS 2 transistors which results in the highest reported per-layer on-current for WS 2 (80 µA/µm per layer) while retaining the high on-off ratio (10 8 ) and low off-current (≈ 5x10 -13 A/μm). Modelling these devices reveals a large interfacial trap density (1×10 13 cm 2 eV -1 ) and a high Schottky barrier height (SBH) at the contacts (0.4 eV).
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