制造BGA技术概述

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI:10.1109/IEMT.1995.526200

Joel Mearig, B. Goers

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引用次数: 18

摘要

球栅阵列(BGA)技术是表面贴装制造的前沿技术之一。BGA技术进步背后的驱动力是标准表面贴装器件的引线间距。当领先的投球低于2000万时，制造变得更加困难。BGA技术在相同的机身尺寸下提供相同的I/O计数，并且显著增加了螺距。制造BGAs可与标准表面贴装器件制造相媲美。用于粘贴、放置、回流和清洗的标准设备将适用于第一代BGAs。本文讨论了BGA制造使用20万SMT制造为基准。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An overview of manufacturing BGA technology

Ball Grid Array (BGA) technology is one ofthe leading edge technologies in surface mount manufacturing. The driving force behind the advancement of BGA technology is the lead spacing of standard surface mount devices. As lead pitches drop below 20 mil, manufacturing becomes exponentially more difficult. BGA technology provides the same I/O count in the same body size with a significant increase in pitch. Manufacturing BGAs is comparable to standard surface mount device manufacturing. Standard equipment for paste application, placement, reflow and cleaning will work with first generation BGAs. The paper discusses BGA manufacturing using 20 mil SMT manufacturing as a baseline.

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来源期刊

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

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