S. Hasegawa, J. Kadomoto, Atsutake Kosuge, T. Kuroda
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A 1 Tb/s/mm2 inductive-coupling side-by-side chip link
An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.
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