隔离边缘轮廓对先进双极晶体管漏击穿特性的影响

P. Ratnam, M. Grubisich, B. Mehrotra, A. Iranmanesh, C. Blair, M. Biswal
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引用次数: 0

摘要

描述了隔离边缘轮廓对新型多发射极NPN双极晶体管漏击穿特性的影响。结果表明,隔离边缘轮廓可以使基极变窄,减小Gummel数,从而控制集电极-发射极击穿电压BV/sub - ceo/和集电极-发射极泄漏电流I/sub - ceo/。BV/sub /的降低可能变得足够严重,以至于器件不能在发射极耦合逻辑(ECL)和BiCMOS电路中使用的最大电源电压下工作。在这些情况下,本征器件的垂直缩放将受到限制,以满足所需的电路击穿特性,从而损害器件参数,如beta和单位增益截止频率。因此,器件隔离可以控制器件的关键参数,从而成为高性能双极器件发展的主要限制因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of isolation edge profile on the leakage and breakdown characteristics of advanced bipolar transistors
The authors describe the effect of the isolation edge profile on the leakage and breakdown characteristics of advanced poly emitter NPN bipolar transistors. It is shown that the isolation edge profile can cause considerable base narrowing and reduction of the Gummel number, thus controlling the collector-emitter breakdown voltage, BV/sub ceo/, and the collector-emitter leakage current, I/sub ceo/. The reduction in BV/sub ceo/ can become severe enough so that the devices cannot operate at the maximum supply voltages used in emitter coupled logic (ECL) and BiCMOS circuits. The vertical scaling of the intrinsic device will be constrained under these circumstances to meet the required circuit breakdown characteristics, compromising device parameters such as beta and the unity gain cutoff frequency. Therefore device isolation can control key device parameters, thus becoming a major limiting factor in the development of high-performance bipolar devices.<>
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