Challenges in the packaging of an eight way server

Summary form only given. The Saber system by Intel's Enterprise Server Division is an excellent example of the multivariable driven nature of system packaging for cost, performance, use and service that characterizes high volume servers. The Saber is based around the Intel Xeon processor and the Profusion eight way capable chip-set and provides excellent performance on TPM-C performance and cost/performance benchmarks. The system supports eight Pentium III Xeon processors with up to 32 GB of PC-100 SDRAM, 10 hot plug PCI-66 slots and fully redundant power and cooling. The package is compliant to major OEM requirements, being 7U in height and 28" deep with space for hot plug hard drives to support the OS boot and swap space requirements as well as some data space. This presentation describes some of the challenges and solutions to the packaging of the Saber eight way system. The system required chip-set and board-set partitioning that supported the dual 100 MHz front side buses accommodating the Pentium III Xeon processors and the memory array. Use of high performance connectors and improved board materials were made while simulation and verification allowed the integration to meet cost and performance goals. For package longevity, processor power was set at 75 W in anticipation of one more performance stepping, putting a serious load on cooling. Airflow paths for the processors, memory and PCI slots were integrated into a complete model along with the chassis and power supplies to arrive at a solution. User serviceability and OEM differentiability were key to industrial design and packaging of the system and its modules.