玻璃体密封在密封包装中的结晶

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346819

R.O. Pantaleon, M. Mena

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引用次数: 0

摘要

陶瓷封装中的钝玻璃导致镀锡部件引线之间的电桥接，这是由于在焊接玻璃表面形成金属铅晶体造成的。受控密封气氛测试表明，密封炉中存在少量含碳和含氢溶剂，导致金属铅晶体的形成。铅晶体可以在镀锡之前用硝酸溶解以消除桥接。玻璃在硝酸中的溶解由等式描述:/spl tri/W (mg/inch square)=23[H/sup +/] exp(-0.4/RT)t。另外两种类型的晶体，柱状氧化铅和针状水铈矿也会在焊接玻璃表面形成，但它们不会影响封装的可靠性。

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Crystallization of vitreous seal in hermetic packages

Dull glass in ceramic packages which leads to electrical bridging between leads of tin plated parts has been identified to be due to the formation of metallic lead crystals on the solder glass surface. Controlled sealing atmosphere testing revealed that the presence of small amounts of carbon and hydrogen-containing solvents in the sealing furnace results in the formation of metallic lead crystals. The lead crystals may be dissolved with nitric acid prior to tin plating to eliminate bridging. The glass dissolution in nitric acid is described by the equation: /spl utri/W (mg/inch square)=23[H/sup +/] exp(-0.4/RT)t. Two other types of crystals, columnar lead oxide and acicular hydrocerrusite are also formed on the solder glass surface but they do not impact the reliability of the package.<>

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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