大块氮化镓衬底上的功率器件:ARPA-E的交换机计划概述

T. Heidel, P. Gradzki
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引用次数: 12

摘要

宽带隙功率半导体器件在广泛的应用中提供了大量的能源效率机会。然而,到目前为止,相对较高的成本阻碍了这些器件在许多大批量应用中的广泛采用。高质量GaN衬底的最新进展为氮化镓垂直功率半导体器件的发展提供了新的潜在途径。如果成功开发,这些器件可以在更高功率水平上提供与硅基功率器件同等功能成本的途径。美国能源高级研究计划局(ARPA-E)最近启动的SWITCHES计划旨在开发体积GaN、1200v、100a晶体管和二极管。在本文中,我们概述了该计划中的技术方法,并讨论了一些主要的预期挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power devices on bulk gallium nitride substrates: An overview of ARPA-E's SWITCHES program
Wide bandgap power semiconductor devices offer substantial energy efficiency opportunities in a wide range of applications. However, to date, relatively high cost has impeded the widespread adoption of these devices in many high volume applications. Recent progress in high quality bulk GaN substrates offers a new potential pathway to the development of novel vertical power semiconductor devices in gallium nitride. If successfully developed, these devices could offer a pathway to functional cost parity with silicon-based power devices at higher power levels. The Advanced Research Projects Agency-Energy (ARPA-E)'s recently launched SWITCHES program is targeting the development of bulk GaN, 1200 V, 100 A transistors and diodes. In this paper, we give an overview of the technical approaches within the program and discuss some of the major anticipated challenges.
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