45nm 2port 8T-SRAM,采用分层复制位线技术,可避免同步读写访问问题

S. Ishikura, M. Kurumada, T. Terano, Y. Yamagami, N. Kotani, K. Satomi, K. Nii, M. Yabuuchi, Y. Tsukamoto, S. Ohbayashi, T. Oashi, H. Makino, H. Shinohara, H. Akamatsu
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引用次数: 15

摘要

我们提出了一种新的2端口(2P) SRAM,具有8T单比特线(SBL)存储单元,用于45纳米soc。由于随机阈值电压变化,随着器件尺寸的缩小,访问时间往往会变慢。采用共享本地放大器(DBSA)的分读位线方案在不增加面积损失的情况下实现了快速的访问时间。我们还展示了另一个重要的问题,即通过使用DBSA和8 T-SBL内存单元在同一行上进行同步读写(R/W)访问。存储节点电压升高会导致误读。采用读端检测复制电路(RER)和带虚拟电容的本地读位线(LDC)来解决这一问题。利用这些方案,采用45 nm LSTP CMOS工艺制备了单元尺寸为0.597mum2的128 BLtimes512WL 64Kb 2P-SRAM宏。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 45nm 2port 8T-SRAM using hierarchical replica bitline technique with immunity from simultaneous R/W access issues
We propose a new 2port (2P) SRAM with an 8T single-bit-line (SBL) memory cell for 45 nm SOCs. Access time tends to be slower as the device size is scaled down because of the random threshold-voltage variations. The Divided read Bit line scheme with Shared local Amplifier (DBSA) realizes fast access time without increasing area penalty. We also show an additional important issue of a simultaneous Read and Write (R/W) access at the same row by using DBSA with the 8 T-SBL memory cell. A rise of the storage node voltage causes the misreading. The Read End detecting Replica circuit (RER) and the Local read bit line with Dummy Capacitance (LDC) are introduced to solve this issue. A 128 BLtimes512WL 64Kb 2P-SRAM macro which cell size is 0.597mum2 using these schemes was fabricated by 45 nm LSTP CMOS process.
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