电子器件混合pcb设计概念综述

2008 International Conference on Advances in Electronics and Micro-electronics Pub Date : 2008-09-29 DOI:10.1109/ENICS.2008.12

M. Sierra, J. Jiménez, E. Andino, J. Garate, J.L. Martin

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引用次数: 0

摘要

本文综述了用于混合技术的电子设备的混合PCB(印刷电路板)设计的主要概念和原理，即同一PCB内的模拟，RF(射频)和数字组件，如特性阻抗，层堆叠和屏蔽。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Review of Concepts Involved in Mixed PCBs Design for Electronic Devices

The present paper provides a review of the main concepts and principles involved in mixed PCBs (printed circuit board) design for electronic devices with mixed technologies, i.e. analog, RF (radio frequency) and digital components within the same PCB, such as characteristic impedance, layer stack-up and shielding.

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2008 International Conference on Advances in Electronics and Micro-electronics

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