一个有效的SPC方法来监控半导体制造过程与多个变化源

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130) Pub Date : 2000-09-26 DOI:10.1109/ISSM.2000.993710

A. Chen, R. Guo, P.-J. Yeh

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引用次数: 5

摘要

在本研究中，我们开发了一种集成采样和统计过程控制(SPC)策略，用于具有多个变化源的半导体过程。我们首先构建一个过程模型来表征半导体过程的复杂性。模型中考虑了三种类型的变化:场地间、区域间和批间变化。基于该过程模型和合理的子分组技术，实现了多变量。然后提出T/sup 2/控制图来监视过程变化。结果表明，所提出的控制图在检测各种类型的过程偏差方面比传统的制图技术更有效。

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An effective SPC approach to monitoring semiconductor manufacturing processes with multiple variation sources

In this research, we develop an integrated sampling and statistical process control (SPC) strategy for semiconductor processes with multiple variation sources. We first construct a process model to characterize the complex nature of semiconductor processes. Three types of variations: among-site, among-zone and among-batch variations, are considered in the model. Based on this process model and rational sub-grouping techniques, multivariate. T/sup 2/ control charts are then proposed to monitor the process variations. It is shown that the proposed control charts are more effective than conventional charting techniques in detecting various types of process excursions.

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Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)

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