TANOS NAND闪存程序/擦除循环中窗口不稳定性的研究

G. Van den bosch, L. Breuil, A. Cacciato, A. Rothschild, M. Jurczak, J. van Houdt
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引用次数: 20

摘要

TANOS的寿命主要由电应力产生的衬底-隧道氧化物界面的界面陷阱决定,而不是由隧道氧化物/阻挡电介质中的固定电荷或氮化物中的不完全电荷补偿决定。作为接受者回应的结果。上部区域供体圈闭形成。在Si带隙的下半部分,V,h编程/擦除窗口单调向上移动,而vfb窗口则表现出反转行为。接口trap产生率在擦除操作期间最高,也取决于内存堆栈进程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of Window Instability in Program/Erase Cycling of TANOS NAND Flash Memory
TANOS endurance is mainly governed by interface traps at the substrate-tunnel oxide interface, generated upon electrical stress, rather than by fixed charge in the tunnel oxide/blocking dielectric or by incomplete charge compensation in the nitride. As a result of acceptor resp. donor trap formation in the upper resp. lower half of the Si band gap, the V,h program/erase window monotonically shifts upward whereas the V fb window exhibits turn-around behavior. Interface trap generation rate is highest during the erase operation and depends also on the memory stack process.
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