多栅极和绝缘体上硅MOSFET器件的小信号、射频仿真研究

A. Breed, K. Roenker
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引用次数: 10

摘要

由于其优越的缩放特性和减少的短通道效应,多栅极mosfet正被考虑在数字应用中取代传统的平面硅mosfet。与此同时,传统mosfet高频性能的改进使其对射频应用越来越有吸引力。本文通过对多栅极mosfet的小信号行为进行仿真研究,考察了它们在射频环境下的性能。三维数值模拟研究了两种最有前途的多栅极器件,即finFET和三极管的高频性能。与finFET相比,三角晶体管具有更高的跨导、小信号电流增益和单侧功率增益,以及更高的截止频率f/sub T/和最大振荡频率f/sub MAX/。当栅极长度为50 nm时,finFET和三极管的f/sub T/峰值分别为42和51 GHz, f/sub MAX/峰值分别为183和228 GHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A small-signal, RF simulation study of multiple-gate and silicon-on-insulator MOSFET devices
Because of their superior scaling characteristics and reduced short channel effects, multi-gate MOSFETs are being considered for replacing conventional planar silicon MOSFETs in digital applications. At the same time, improvements in the high frequency capabilities of conventional MOSFETs have made them increasingly attractive for RF applications. The paper examines the performance capabilities of multi-gate MOSFETs in the RF regime using a simulation study of their small-signal behavior. Three dimensional numerical simulations have been performed to investigate the high frequency performance of two of the most promising multigate devices, i.e. the finFET and the trigate transistor. The trigate transistor has been found to exhibit a higher transconductance, small signal current gain and unilateral power gain as compared to the finFET, as well as a higher cutoff frequency, f/sub T/, and maximum frequency of oscillation, f/sub MAX/. Peak f/sub T/ of 42 and 51 GHz and peak f/sub MAX/ of 183 and 228 GHz were obtained for the finFET and trigate transistors, respectively, for a gate length of 50 nm.
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