{"title":"跌落冲击下PCB振动模态对板级封装焊点剥落应力的影响","authors":"B. Jie, Q. Fei, An Tong, Na Chen","doi":"10.1109/ICEPT.2007.4441409","DOIUrl":null,"url":null,"abstract":"In this paper, a very detailed finite element model of PCB board and BGA package was constructed. A dynamic drop/impact simulation of the board-level package was conducted by LS-DYNA and Input-G approach under the drop Condition H recommended by JEDEC standard JESD22-B111. A PCB deflection equivalent static analysis was conducted also in order to investigate the difference of peeling stress between the dynamic and the static model.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of PCB Vibration Modal on Peeling Stress of Solder Joints in Board-level Package Under Drop Impact\",\"authors\":\"B. Jie, Q. Fei, An Tong, Na Chen\",\"doi\":\"10.1109/ICEPT.2007.4441409\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a very detailed finite element model of PCB board and BGA package was constructed. A dynamic drop/impact simulation of the board-level package was conducted by LS-DYNA and Input-G approach under the drop Condition H recommended by JEDEC standard JESD22-B111. A PCB deflection equivalent static analysis was conducted also in order to investigate the difference of peeling stress between the dynamic and the static model.\",\"PeriodicalId\":325619,\"journal\":{\"name\":\"2007 8th International Conference on Electronic Packaging Technology\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 8th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2007.4441409\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of PCB Vibration Modal on Peeling Stress of Solder Joints in Board-level Package Under Drop Impact
In this paper, a very detailed finite element model of PCB board and BGA package was constructed. A dynamic drop/impact simulation of the board-level package was conducted by LS-DYNA and Input-G approach under the drop Condition H recommended by JEDEC standard JESD22-B111. A PCB deflection equivalent static analysis was conducted also in order to investigate the difference of peeling stress between the dynamic and the static model.
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