基于三阱工艺的相控阵多堆叠CMOS毫米波功率放大器设计

M. Montaseri, R. Vuohtoniemi, J. Aikio, T. Rahkonen, A. Pärssinen
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引用次数: 2

摘要

本文研究了采用三阱工艺设计适合相控阵前端应用的多层CMOS毫米波功率放大器。对三井技术产生的寄生效应进行了研究,并采用负电容技术进行了补偿,保证了三井技术的正常运行。设计技术采用台积电28nm CMOS工艺,在28GHz工作频率下作为5G系统的候选工作频段进行评估。结果表明,功率增益为25dB,饱和功率为22dBm,最大PAE为38%,并且堆栈之间具有优越的相位对准性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of Multi-Stacked CMOS mm-Wave Power Amplifiers for Phased Array Applications Using Triple-Well Process
This paper concerns with the design of multi-stacked CMOS millimeter-wave power amplifiers suitable for phased array front-end applications using triple-well process. The parasitics posed by the triple-well technique are studied and compensated using negative capacitance technique for proper operation. The design technique is evaluated using TSMC 28nm CMOS process at 28GHz operating frequency as a candidate operating band for 5G systems. The results illustrate a power gain of 25dB, 22dBm saturated power, and a maximum 38% PAE along with superior phase alignment between stacks.
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