倒置扫描传感器安装技术:用于故障分析的低成本的IGBT模块声学扫描

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-09-18 DOI:10.1109/IPFA.2014.6898152

E. J. de La Cruz, Sheenel Karl De La Rea, Stephen McDonough, S. F. Chai

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引用次数: 1

摘要

对IGBT模块进行声波扫描是发现可能导致现场故障的异常的关键过程。然而，构建这种用于故障分析的功能的成本相对昂贵。本文旨在评估适用于故障的IGBT模块的低成本声扫描技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Inverted scan transducer mount technique: A cost effective acoustic scanning of IGBT modules for failure analysis

Acoustic Scanning for IGBT modules is a critical process to find anomalies that could lead to field failures. However, the cost to build this capability for failure analysis use is relatively expensive. This paper aims at evaluating a cost effective acoustic scanning technique for IGBT modules suitable for failure.

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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