沿着三联结扩散这是窄铜导体线的途径吗?

2012 IEEE International Integrated Reliability Workshop Final Report Pub Date : 2012-10-01 DOI:10.1109/IIRW.2012.6468943

J. Lloyd, S. Adamshick, C. Durcan, Y. Kandel, I. N. Lund, B. McGowan, C. Settens, Z. Zhang

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引用次数: 0

摘要

从理论上探讨了极薄小尺寸金属纳米导体中主要质量传递途径的可能性。可以看出，如果我们考虑与帽和/或衬里相交的晶界的三重结，则可以解释观察结果，并且晶界从来都不是一个重要的途径。

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Diffusion along triple junctions is this the pathway for narrow Cu conductor lines?

The possibility that the major mass transport pathway in very thin small dimension metallic nanoconductors is explored theoretically. It is seen that if we consider the triple junctions of the grain boundary intersecting with the cap and/or the liner the observations can be accounted for and that the grain boundary is never an important pathway.

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2012 IEEE International Integrated Reliability Workshop Final Report

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