芯片上的多媒体复合体

1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC Pub Date : 1996-02-08 DOI:10.1109/ISSCC.1996.488498

H. Sasaki

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引用次数: 36

摘要

本文讨论了在芯片上集成多媒体复合体并打开多媒体世界所需的固态电路技术。讨论了多媒体扩展的必要条件、数字信号处理与固态电路技术的关系、该技术的发展前景、多媒体综合体的未来展望以及三个设计问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Multimedia complex on a chip

This paper discusses the solid-state circuit technology needed to integrate a multimedia complex on a chip and open up the multimedia world. The requisites for expansion of multimedia, the relation between digital signal processing and solid-state circuit technology, the outlook for the technology, a view of the multimedia complex in the future, and three design issues are discussed.

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来源期刊

1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC

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