通过Hast、85/85和Pct对Mcm应用的非密封涂层进行评价

C. Murphy, R. Kodnani, D. Peterson
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引用次数: 5

摘要

无密封性可靠性(RwoH)项目的目标是寻找用于mcm的非密封性涂层。作为一种向下选择涂层材料的方法,Sandia ATC01测试芯片在40针的dip中涂覆了非密封的聚合物材料,包括硅凝胶,填充环氧树脂和聚酰亚胺。在通过温度循环和气氛进行预处理后,零件受到三种不同温度,湿度和偏置条件中的一种:HAST (140/spl℃,85% RH, +40V), 85/85 (85/spl℃,85% RH, +40V)或PCT (121/spl℃,99.6% RH)。未观察到在HAST测试和85/85测试中寿命之间的普遍关系-效果似乎是物质依赖的。电气测试数据表明,涂层部件(采用标准SiN芯片钝化)的故障不会发生在模具电路(三道)上,而是发生在连接线和连接垫上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of Non-Hermetic Coatings for Mcm Applications through Hast, 85/85 and Pct
The goal of the Reliability without Hermeticity (RwoH) Project is to find non-hermetic coatings for use on MCMs. As a means of down-selecting coating materials, Sandia ATC01 test chips in 40 pin DIPs were coated with non-hermetic, polymer materials, including silicone gel, filled epoxy, and polyimide. After preconditioning through temperature cycling and atmosphere, the parts were subjected to one of three different temperature, humidity, and bias conditions: HAST (140/spl deg/C, 85% RH, +40V), 85/85 (85/spl deg/C, 85% RH, +40V), or PCT (121/spl deg/C, 99.6% RH). No universal relationship between lifetime in HAST and 85/85 testing was observed-the effects appear to be material dependent. Electrical test data suggest that failures on coated parts (with standard SiN chip passivation) do not occur on die circuitry (triple tracks) and instead occur on bond-wires and bond-pads.
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