{"title":"汽车用系统芯片","authors":"A. Foletto, V. Poletto","doi":"10.1109/WCT.2004.239808","DOIUrl":null,"url":null,"abstract":"Two examples of single chip system ICs for automotive applications are described. Both are equipped with an 8-bit microcontroller, double poly EPROM for software code, various standard microcontroller peripherals, voltage regulators for battery interface, A/D for sensor interface, 100 m/spl Omega/ power devices for load drive, and physical layers for line communication interface. All integrated in a single chip. The challenges of diffusion, assembly and test processes are addressed.","PeriodicalId":303825,"journal":{"name":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"System chips for automotive applications\",\"authors\":\"A. Foletto, V. Poletto\",\"doi\":\"10.1109/WCT.2004.239808\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Two examples of single chip system ICs for automotive applications are described. Both are equipped with an 8-bit microcontroller, double poly EPROM for software code, various standard microcontroller peripherals, voltage regulators for battery interface, A/D for sensor interface, 100 m/spl Omega/ power devices for load drive, and physical layers for line communication interface. All integrated in a single chip. The challenges of diffusion, assembly and test processes are addressed.\",\"PeriodicalId\":303825,\"journal\":{\"name\":\"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WCT.2004.239808\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WCT.2004.239808","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Two examples of single chip system ICs for automotive applications are described. Both are equipped with an 8-bit microcontroller, double poly EPROM for software code, various standard microcontroller peripherals, voltage regulators for battery interface, A/D for sensor interface, 100 m/spl Omega/ power devices for load drive, and physical layers for line communication interface. All integrated in a single chip. The challenges of diffusion, assembly and test processes are addressed.
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