低功耗射频微系统技术与设计

E. McShane, K. Shenai
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引用次数: 3

摘要

便携式射频通信设备是一个快速增长的细分市场。这些设备通常由电池供电,需要支持低电压、低功耗运行的技术。考虑到系统尺寸不断缩小,射频技术还必须能够与逻辑或混合信号电路集成,从而形成复杂的射频微系统。在本文中,射频微系统的技术和设计描述了主要竞争对手:Si CMOS, Si BJT, SiGe HBT,以及GaAs MESFET, HEMT和HBT。评价明确指出射频微系统在下一个千年的发展方向。本文还介绍了一个由处理器核心和无线射频收发器组成的射频微系统的实例研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technologies and design of low-power RF microsystems
Portable RF communications devices are a fast-growing market segment. Typically battery operated, these devices demand technologies that support low-voltage, low-power operation. Considering that system dimensions are continually shrinking, an RF technology must also be amenable to integration with logic or mixed-signal circuitry leading to complex RF microsystems. In this paper, the technologies and design of RF microsystems are described with respect to the primary competitors: Si CMOS, Si BJT, SiGe HBT, and GaAs MESFET, HEMT, and HBT. The evaluations clearly identify the direction of RF microsystems development into the next millennium. A case study is also presented of an RF microsystem comprised of a processor core and a wireless RF transceiver.
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