{"title":"一种控制表面电位的碱性溶液中x射线掩膜清洗新技术","authors":"M. Tuda, M. Kinugawa, H. Ootera, K. Marumoto","doi":"10.1109/IMNC.2000.872619","DOIUrl":null,"url":null,"abstract":"This paper presents an electrochemical surface cleaning (ECSC) technique for x-ray masks employing amorphous WN/sub x/ absorbers. The electrostatic surface potential of the mask in alkaline solutions is precisely controlled for preventing from corrosion or etching of absorber films during cleaning, thus leading to almost no change in pattern dimension and film stress between before and after cleaning.","PeriodicalId":270640,"journal":{"name":"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new cleaning technique for x-ray masks in alkaline solutions by control of surface potential\",\"authors\":\"M. Tuda, M. Kinugawa, H. Ootera, K. Marumoto\",\"doi\":\"10.1109/IMNC.2000.872619\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an electrochemical surface cleaning (ECSC) technique for x-ray masks employing amorphous WN/sub x/ absorbers. The electrostatic surface potential of the mask in alkaline solutions is precisely controlled for preventing from corrosion or etching of absorber films during cleaning, thus leading to almost no change in pattern dimension and film stress between before and after cleaning.\",\"PeriodicalId\":270640,\"journal\":{\"name\":\"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)\",\"volume\":\"90 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMNC.2000.872619\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMNC.2000.872619","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new cleaning technique for x-ray masks in alkaline solutions by control of surface potential
This paper presents an electrochemical surface cleaning (ECSC) technique for x-ray masks employing amorphous WN/sub x/ absorbers. The electrostatic surface potential of the mask in alkaline solutions is precisely controlled for preventing from corrosion or etching of absorber films during cleaning, thus leading to almost no change in pattern dimension and film stress between before and after cleaning.