一种新型的软误差免疫SRAM单元

Xuemei Liu, L. Pan, X. Zhao, Fengying Qiao, Dong Wu, Jun Xu
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引用次数: 4

摘要

技术节点的缩小使集成电路更容易受到软错误的影响,通常是由辐射打击引起的。在本文中,我们提出了一种新的软误差抗扰(SEI) SRAM单元,该单元采用标准的65nm CMOS工艺,具有良好的软误差容错性,特别是在读取状态。SPICE仿真结果表明,该单元对工艺、电压和温度的变化具有较强的鲁棒性。广泛的三维技术计算机辅助设计(TCAD)仿真分析表明,所提出的单元可以恢复扰动状态。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel soft error immunity SRAM cell
The scaling down of the technology node makes integrated circuits more susceptible to soft errors, normally caused by radiation strike. In this paper, we propose a novel Soft Error Immunity (SEI) SRAM cell using a standard 65nm CMOS process, which has good tolerance to soft errors, especially at read state. SPICE simulation results show that the proposed cell is robust to the variation of process, voltage and temperature. Extensive 3-D technology computer-aided design (TCAD) simulation analyses show that the proposed cell can recover the upset-state.
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