下一代CMOS器件建模的表面电位+方法

Jin He, X. Xi, H. Wan, M. Chan, A. Niknejad, C. Hu
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引用次数: 0

摘要

本文概述了用于下一代CMOS器件建模的先进的表面电位加(SPP)方法。该方法的主要目的是从包括各种物理效应在内的基本器件物理学出发,建立一个连续的、完全对称的、精确的先进电荷基MOS晶体管模型。首次得到了统一的、适用于均匀和逆行掺杂情况的精确反转电荷关系。在此模型中,对各种小维度效应进行了阐述和简洁的整合。最后与实测数据进行了比较,验证了新模型的有效性。重要的是,它也扩展到UTB和双栅mosfet。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface-potential-plus approach for next generation CMOS device modeling
This paper outlines the advanced Surface-Potential-Plus (SPP) approach for the next generation CMOS device modeling. The main object of this approach is to develop a continuous, completely symmetric and accurate advanced charge-based MOS transistor model from the basic device physics including various physics effects. A unified exact inversion charge relation valid for uniform and retrograde doping cases is first obtained. Various small dimensional effects are elucidated and integrated concisely into this model. Comparison with measured data is finally presented to validate the new model. Importantly, it was also extended to UTB and double-gate MOSFETs.
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