基于70纳米GaAs-mHEMT技术的FDD系统d波段收发器

M. Ito, T. Okawa, T. Marumoto
{"title":"基于70纳米GaAs-mHEMT技术的FDD系统d波段收发器","authors":"M. Ito, T. Okawa, T. Marumoto","doi":"10.1109/BCICTS45179.2019.8972754","DOIUrl":null,"url":null,"abstract":"This paper presents a D-band transceiver utilizing a 70-nm GaAs metamorphic high electron mobility transistor (mHEMT) technology for a frequency division duplex (FDD) system. The transceiver includes a duplexer, transmitter and receiver modules, an LO and IF circuit board, and a real-time modem. Each module comprises a silica-based package on which D-band converter and E-band multiplier monolithic microwave integrated circuits (MMICs) are mounted using a flip-chip bonding technique. Real-time communication tests are performed at 142- and 157-GHz duplex frequencies. A 10-Gbps transmission with a high spectral efficiency are achieved using a 128 quadrature amplitude modulation (QAM) signal.","PeriodicalId":243314,"journal":{"name":"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"D-band Transceiver Utilizing 70-nm GaAs-mHEMT Technology for FDD System\",\"authors\":\"M. Ito, T. Okawa, T. Marumoto\",\"doi\":\"10.1109/BCICTS45179.2019.8972754\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a D-band transceiver utilizing a 70-nm GaAs metamorphic high electron mobility transistor (mHEMT) technology for a frequency division duplex (FDD) system. The transceiver includes a duplexer, transmitter and receiver modules, an LO and IF circuit board, and a real-time modem. Each module comprises a silica-based package on which D-band converter and E-band multiplier monolithic microwave integrated circuits (MMICs) are mounted using a flip-chip bonding technique. Real-time communication tests are performed at 142- and 157-GHz duplex frequencies. A 10-Gbps transmission with a high spectral efficiency are achieved using a 128 quadrature amplitude modulation (QAM) signal.\",\"PeriodicalId\":243314,\"journal\":{\"name\":\"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/BCICTS45179.2019.8972754\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BCICTS45179.2019.8972754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

本文提出了一种采用70 nm砷化镓变质高电子迁移率晶体管(mHEMT)技术的d波段收发器,用于分频双工(FDD)系统。收发器包括双工器、发送器和接收器模块、LO和IF电路板以及实时调制解调器。每个模块包括一个基于硅的封装,其中d波段转换器和e波段倍增器单片微波集成电路(mmic)使用倒装芯片键合技术安装。实时通信测试在142 ghz和157 ghz双工频率下进行。采用128正交调幅(QAM)信号,实现了10gbps的高频谱效率传输。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
D-band Transceiver Utilizing 70-nm GaAs-mHEMT Technology for FDD System
This paper presents a D-band transceiver utilizing a 70-nm GaAs metamorphic high electron mobility transistor (mHEMT) technology for a frequency division duplex (FDD) system. The transceiver includes a duplexer, transmitter and receiver modules, an LO and IF circuit board, and a real-time modem. Each module comprises a silica-based package on which D-band converter and E-band multiplier monolithic microwave integrated circuits (MMICs) are mounted using a flip-chip bonding technique. Real-time communication tests are performed at 142- and 157-GHz duplex frequencies. A 10-Gbps transmission with a high spectral efficiency are achieved using a 128 quadrature amplitude modulation (QAM) signal.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信