研发半导体晶圆制造的周期时间指标

N. Pierce, A. Yost
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引用次数: 2

摘要

本文介绍了在研发环境中成功开发和有效使用半导体晶圆制造周期时间指标的案例研究。度量包括理论周期时间(MTCT)的倍数、周期时间的分解分析和基线进程的累积队列时间。这些指标中的每一个都应用于设备类型、工艺配方、整体试验线性能以及生产领域,如薄膜、植入和蚀刻。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cycle time metrics for R&D semiconductor wafer fabrication
This paper presents a case study for the successful development and effective use of cycle time metrics for fabricating semiconductor wafers in a research and development (R&D) environment. The metrics include multiples of theoretical cycle time (MTCT), breakdown analysis of cycle time, and cumulative queue times of baseline processes. Each of these metrics was applied to equipment types, process recipes, and overall pilot line performance as well as to production areas such as Films, Implant, and Etch.
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