填料中线接强度下降的研究

2009 11th Electronics Packaging Technology Conference Pub Date : 2009-12-01 DOI:10.1109/EPTC.2009.5416519

Zhang Dezheng, Bao Shengxiang, Ma Lili, Lv Dechun

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引用次数: 0

摘要

对于微电子封装来说，以线键合的方式将基板与引脚线连接起来，用于单独的电子元件封装，也称为线键合技术。长期以来，洛基效应被认为是正常的无效形式。但现在越来越多的研究表明，Kiekendall空洞是影响粘接强度的主要因素。针对SOT23型晶体管，分析了线键合的Kiekendall空洞的形成。

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Research on strength descent of wire bonding in the packing

For microelectronics packaging, it connects the substrates with pin wire in the way of wire bonding for separate electronic components packing, and also called wire bonding technology. For a long time, rockii effect is thought as the normal invalid forms. But now the more and more study shows Kiekendall voids are the main factors that influence the bonding intensity. Aiming at the model SOT23 transistor, we analysis the form of Kiekendall voids of wire bonding.

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2009 11th Electronics Packaging Technology Conference

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