90纳米SoC应用处理器的泄漏功耗降低技术

P. Royannez, H. Mair, F. Dahan, M. Wagner, M. Streeter, L. Bouetel, J. Blasquez, H. Clasen, G. Semino, J. Dong, D. Scott, B. Pitts, C. Raibaut, U. Ko
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引用次数: 1

摘要

在90纳米,泄漏电流使待机功率达到不可接受的水平,电路级技术成为强制性的。然而,应用这些技术必须是健壮和实用的。在本文中,我们不仅关注减少泄漏的解决方案,而且还关注它们作为全球基础设施的部署,因为附加值不仅在于技术本身,还在于它们的实现方式,以构建高效,可重用,强大,低成本和便携式平台。技术已经在90纳米TI CMOS技术上进行了硅验证,通常用于设计复杂性超过1亿个晶体管的SoC
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Leakage Power Reduction Techniques applied to 90-nm SoC Application Processor
At the 90-nm, leakage currents bring standby power to an unacceptable level and circuit level techniques become mandatory. However applying these techniques must be robust and practical. In this paper we focus not only on leakage reduction solutions but also on their deployment as a worldwide infrastructure as the added-value resides not only in the techniques themselves but also in the way they are implemented to build an efficient, re-usable, robust, low cost and portable platform. Techniques have been silicon proven on the 90-nm TI CMOS technology and is commonly used to design SoC with complexities over 100 million transistors
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