一种新型高持压可控硅型ESD保护结构的研制

G. Meneghesso, A. Tazzoli, F. A. Marino, M. Cordoni, P. Colombo
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引用次数: 27

摘要

研制了一种新型的可控硅低压触发整流器(SCR-LVT),作为静电放电(ESD)事件的保护结构。由于插入了两个寄生双极晶体管,从而在传统的可控硅结构中增加了n埋区,从而获得了高保持电压。这两个寄生晶体管部分破坏了两个主要的npn和pnp bjt的环路反馈增益,导致在ESD事件期间维持(保持)电压的增加。保持电压与ESD脉冲宽度的强烈依赖性也被观察到,这是由自热效应引起的。2D设备模拟(DESSIS Synopsys)已经执行,获得了在宽温度范围(25℃-125℃)内完美匹配的测量结果。利用器件仿真结果,解释了影响保持电压的因素,包括温度依赖性,以及寄生bjt的行为。在不改变工艺参数的情况下,改变可控硅保持电压与可控硅设计布局有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of a new high holding voltage SCR-based ESD protection structure
A new silicon controlled rectifier low voltage triggered (SCR-LVT), to be adopted as protection structure against electrostatic discharge (ESD) events, has been developed and characterized. A high holding voltage has been obtained thanks to the insertion of two parasitic bipolar transistors, achieved adding a n-buried region to a conventional SCR structure. These two parasitic transistors partially destroy the loop feedback gain of the two main npn and pnp BJTs, resulting in an increase of the sustaining (holding) voltage during the ESD event. A strong dependence of the holding voltage with the ESD pulse width has also been observed, caused by self-heating effects. 2D device simulations (DESSIS Synopsys) have been performed obtaining results that perfectly fit the measurements over a wide temperature range (25 degC-125 degC). Using device simulation results , the factors that influence the holding voltage, in terms of temperature dependence, but also in the behavior of the parasitic BJTs, are explained. A guideline to change the SCR holding voltage, related to the SCR design layout without any change to process parameters, is also proposed.
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