{"title":"I/O引脚焊点检测系统","authors":"T. Koezuka, Yoshinori Suto, M. Ando","doi":"10.1109/IEMT.1993.639760","DOIUrl":null,"url":null,"abstract":"We have developed an automated inspection system that features perpendicular and variable-intensity lighting for image c o n a t enhancement and improved sensing accuracy a high-resolution camera with reflection-adaptive b i n d t i o n for improved image processing, and an adaptive inspection algorithm that modifies its defect definition criteria according to target position quickly, accurately, and reliably inspect highly dense arrays of perpendicular I/O pins soldered onto a ceramic printed wiring board (PWB). The system's Mega-Scope, a highresolution, eight-bit gray-scale CCD camera, images a 2048x2048-pixel area with a 10 pm resolution in 4 seconds, taking 60 U0 pin images at a time. The total time to inspect the position and solder fillet condition of more than eight thousand U0 pins is just U) minutes.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"I/O Pin Solder Point Inspection System\",\"authors\":\"T. Koezuka, Yoshinori Suto, M. Ando\",\"doi\":\"10.1109/IEMT.1993.639760\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed an automated inspection system that features perpendicular and variable-intensity lighting for image c o n a t enhancement and improved sensing accuracy a high-resolution camera with reflection-adaptive b i n d t i o n for improved image processing, and an adaptive inspection algorithm that modifies its defect definition criteria according to target position quickly, accurately, and reliably inspect highly dense arrays of perpendicular I/O pins soldered onto a ceramic printed wiring board (PWB). The system's Mega-Scope, a highresolution, eight-bit gray-scale CCD camera, images a 2048x2048-pixel area with a 10 pm resolution in 4 seconds, taking 60 U0 pin images at a time. The total time to inspect the position and solder fillet condition of more than eight thousand U0 pins is just U) minutes.\",\"PeriodicalId\":170695,\"journal\":{\"name\":\"Proceedings of Japan International Electronic Manufacturing Technology Symposium\",\"volume\":\"52 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Japan International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.639760\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.639760","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We have developed an automated inspection system that features perpendicular and variable-intensity lighting for image c o n a t enhancement and improved sensing accuracy a high-resolution camera with reflection-adaptive b i n d t i o n for improved image processing, and an adaptive inspection algorithm that modifies its defect definition criteria according to target position quickly, accurately, and reliably inspect highly dense arrays of perpendicular I/O pins soldered onto a ceramic printed wiring board (PWB). The system's Mega-Scope, a highresolution, eight-bit gray-scale CCD camera, images a 2048x2048-pixel area with a 10 pm resolution in 4 seconds, taking 60 U0 pin images at a time. The total time to inspect the position and solder fillet condition of more than eight thousand U0 pins is just U) minutes.
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