Jicheng Zhang, Yangjian Xu, L. Liang, Yuanxiang Zhang, Y. Liu
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The effect of micro-structure evolution in electromigration on the reliability of solder joints
Electromigration (EM) in solder joints has become a critical reliability issue with the development of electronic industry. This paper studied two different failure modes during EM testing: atom migration dominated failure and crack dominated failure. Experimental study on EM was carried out in a typical testing circuit subjected to different current and environment temperature. Here, two different environment temperatures in consideration of two current densities have been studied. Finally, some significant conclusions have derived, which are consistent with the other related studies and knowledge.
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