{"title":"一个用于引脚网格阵列的自动路由器包","authors":"Shuenn-Shi Chen, Jong-Jang Chen, Sao-Jie Chen, Chia-Chun Tsai","doi":"10.1109/ASPDAC.1999.759783","DOIUrl":null,"url":null,"abstract":"A Pin-Grid-Array (PGA) package router is presented in this paper. Given a chip cavity with a number of I/O pads around its boundary and an equivalent number of pins distributed on the substrate, the objective of the router is to complete the planar interconnection of pad-to-pin nets on one or more layers. This router consists of three phases: layer assignment topological routing, and geometrical routing. Examples tested on a windows-based environment show that our router is efficient and can complete the routing task with less substrate layers. Compared to manual routing, this router features a friendly graphic user interface and can be practically applied to VLSI packaging.","PeriodicalId":201352,"journal":{"name":"Proceedings of the ASP-DAC '99 Asia and South Pacific Design Automation Conference 1999 (Cat. No.99EX198)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"An automatic router for the pin grid array package\",\"authors\":\"Shuenn-Shi Chen, Jong-Jang Chen, Sao-Jie Chen, Chia-Chun Tsai\",\"doi\":\"10.1109/ASPDAC.1999.759783\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Pin-Grid-Array (PGA) package router is presented in this paper. Given a chip cavity with a number of I/O pads around its boundary and an equivalent number of pins distributed on the substrate, the objective of the router is to complete the planar interconnection of pad-to-pin nets on one or more layers. This router consists of three phases: layer assignment topological routing, and geometrical routing. Examples tested on a windows-based environment show that our router is efficient and can complete the routing task with less substrate layers. Compared to manual routing, this router features a friendly graphic user interface and can be practically applied to VLSI packaging.\",\"PeriodicalId\":201352,\"journal\":{\"name\":\"Proceedings of the ASP-DAC '99 Asia and South Pacific Design Automation Conference 1999 (Cat. No.99EX198)\",\"volume\":\"65 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-01-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the ASP-DAC '99 Asia and South Pacific Design Automation Conference 1999 (Cat. No.99EX198)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASPDAC.1999.759783\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the ASP-DAC '99 Asia and South Pacific Design Automation Conference 1999 (Cat. No.99EX198)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.1999.759783","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An automatic router for the pin grid array package
A Pin-Grid-Array (PGA) package router is presented in this paper. Given a chip cavity with a number of I/O pads around its boundary and an equivalent number of pins distributed on the substrate, the objective of the router is to complete the planar interconnection of pad-to-pin nets on one or more layers. This router consists of three phases: layer assignment topological routing, and geometrical routing. Examples tested on a windows-based environment show that our router is efficient and can complete the routing task with less substrate layers. Compared to manual routing, this router features a friendly graphic user interface and can be practically applied to VLSI packaging.