高压低温氧化膜随时间介电击穿测量

M. Hirayama, T. Matsukawa, N. Tsubouchi, H. Nakata
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引用次数: 11

摘要

自动测量了二氧化硅薄膜随时间变化的介电击穿特性。这些薄膜是由硅的高压低温氧化得到的。击穿失效与氧化压力无关,而与氧化温度和膜厚度有关。电场加速度因子约为105.6/MV/cm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Time Dependent Dielectric Breakdown Measurement of High Pressure Low Temperature Oxidized Film
Time dependent dielectric breakdown characteristics of the thin silicon dioxide films were automatically measured. These films were obtained from the high pressure low temperature oxidation of silicon. Breakdown failures were independent on the oxidation pressure but dependent on the oxidation temperature and film thickness. The electric field acceleration factor is estimated about 105.6/MV/cm.
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