规划和放置有效的清洁发展机制保护的电源夹

Hsin-Chun Lin, Shih-Ying Liu, Hung-Ming Chen
{"title":"规划和放置有效的清洁发展机制保护的电源夹","authors":"Hsin-Chun Lin, Shih-Ying Liu, Hung-Ming Chen","doi":"10.1109/ICCAD.2014.7001423","DOIUrl":null,"url":null,"abstract":"The issue on reliability of the device becomes more critical as power density of device progressively increases with advancement of technology nodes. Smaller transistor and hence thinner gate oxide implies transistors are more vulnerable against an Electrostatic Discharge (ESD) event. Among the test models in ESD, Charged Device Model (CDM) has greater potential to cause catastrophic damage to the device due to its faster and larger discharging current. To protect against a CDM event, power clamps are placed across the design to offer a low resistance discharge path. However, conventional power clamp placement method to place power clamps generally relies on design experience. In this work, we propose a power clamp placement algorithm that places power clamp at strategic location which can effectively minimize number of power clamps while achieving better protection against a CDM event compared to conventional approach.","PeriodicalId":426584,"journal":{"name":"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Planning and placing power clamps for effective CDM protection\",\"authors\":\"Hsin-Chun Lin, Shih-Ying Liu, Hung-Ming Chen\",\"doi\":\"10.1109/ICCAD.2014.7001423\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The issue on reliability of the device becomes more critical as power density of device progressively increases with advancement of technology nodes. Smaller transistor and hence thinner gate oxide implies transistors are more vulnerable against an Electrostatic Discharge (ESD) event. Among the test models in ESD, Charged Device Model (CDM) has greater potential to cause catastrophic damage to the device due to its faster and larger discharging current. To protect against a CDM event, power clamps are placed across the design to offer a low resistance discharge path. However, conventional power clamp placement method to place power clamps generally relies on design experience. In this work, we propose a power clamp placement algorithm that places power clamp at strategic location which can effectively minimize number of power clamps while achieving better protection against a CDM event compared to conventional approach.\",\"PeriodicalId\":426584,\"journal\":{\"name\":\"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.2014.7001423\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.2014.7001423","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

随着技术节点的不断进步,器件的功率密度不断提高,器件的可靠性问题变得越来越重要。更小的晶体管和更薄的栅极氧化物意味着晶体管更容易受到静电放电(ESD)事件的影响。在ESD的测试模型中,CDM(充电器件模型)由于其放电电流更快、更大,对器件造成灾难性破坏的可能性更大。为了防止CDM事件,在整个设计中放置了电源夹,以提供低电阻放电路径。然而,传统的电源夹放置方法一般依靠设计经验来放置电源夹。在这项工作中,我们提出了一种电源钳放置算法,该算法将电源钳放置在战略位置,与传统方法相比,可以有效地减少电源钳的数量,同时更好地防止CDM事件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Planning and placing power clamps for effective CDM protection
The issue on reliability of the device becomes more critical as power density of device progressively increases with advancement of technology nodes. Smaller transistor and hence thinner gate oxide implies transistors are more vulnerable against an Electrostatic Discharge (ESD) event. Among the test models in ESD, Charged Device Model (CDM) has greater potential to cause catastrophic damage to the device due to its faster and larger discharging current. To protect against a CDM event, power clamps are placed across the design to offer a low resistance discharge path. However, conventional power clamp placement method to place power clamps generally relies on design experience. In this work, we propose a power clamp placement algorithm that places power clamp at strategic location which can effectively minimize number of power clamps while achieving better protection against a CDM event compared to conventional approach.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信