多芯片模块的商业实现还处于起步阶段

[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors Pub Date : 1991-10-14 DOI:10.1109/ICCD.1991.139982

R. Hendel

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引用次数: 2

摘要

多芯片模块(mcm)有潜力引领半导体行业进入下一个功能集成水平。商业上可行的模块的设计、实现和成功实现仍然是难以捉摸的。讨论了影响该技术商业可行性的因素。这些因素包括设计和建模、基板制造、基板和模块的测试以及MCM模块的组装。

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The commercial realization of multi-chip modules quo vadimus

Multi-chip modules (MCMs) have the potential to lead the semiconductor industry to the next level of functional integration. The design, implementation and successful realization of commercially viable modules are still elusive. Factors affecting the commercial viability of this technology are discussed. These factors include design and modeling, substrate fabrication, testing of substrates and modules, and assembly of MCM modules.<>

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[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors

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