涉及安全引导的层级soc混合硅后验证方法:引导(安全和非安全)和随机测试的内核集成

Amandeep Sharan, Ashish Gupta
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引用次数: 1

摘要

半导体行业的设计进步导致了上市时间的缩短,并提高了芯片的质量保证,使其与规格完美结合。因此,后晶片验证在时间到资金方面占很大比例,成为芯片实现中最具杠杆作用的步骤之一。这也给缩短验证周期和广泛自动化以加速验证带来了更大的压力。如今,公司的目标是在更短的时间内完成更复杂的设计。因此,随着SoC复杂性的不断增长,我们需要真正的软件应用程序,专业和随机测试来观察和检查功能,并添加回归和电气测试来检查芯片规格。为此,内核引导是在第一个硅部件上运行完整系统测试的最佳方法之一,然后是随机测试和电气验证。本文提出了一种新的验证流方法,该方法可以促进从各种内存源安全或非安全地启动内核,并在每次迭代中集成随机测试生成。这个流程还涵盖了启动验证、电气验证和复杂的场景,比如带深度睡眠的安全启动。它将把验证运行时间缩短3-4倍,从而显著提高性能,从而大大缩短上市时间。其他改进包括客户满意度指数(CSI)和启动性能质量指数(PQI)以及缩短电气周期。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hybrid Post Silicon Validation Methodology for Layerscape SoCs involving Secure Boot: Boot (Secure & Non-secure) and Kernel Integration with Randomized Test
Design advancements in semiconductor industry have resulted in shrinking schedules of time-to-market and improved quality assurance of the chips to be in perfect tandem with their specifications. Hence, Post-Silicon Validation, having a significant percentage in time-to-money, becomes one of the most highly leveraged steps in chip implementation. This also puts more pressure to reduce the validation cycle and automate extensively to speedup validation. Nowadays, companies are aiming for more complex designs in a shorter duration. So, as the SoC complexity keeps growing, we need real software applications, specialized and random tests to observe and check functionality, added with regression and electrical tests for checking chip specifications. For this, kernel boot is one of the best methodologies to run on the first silicon parts for a complete system test, which is followed by random tests & electrical validation. This paper presents a novel methodology for validation flow which facilitates kernel boot, both secure and non-secure, from various memory sources, integrating random test generation in every iteration. This flow also covers boot validation, electrical validation and complex scenarios like secure boot with deep sleep. It will cut down validation run time by 3-4 times, thus notably improving the performance which will lead to a major reduction in time to market. Other enhancements are in Customer Satisfaction Index (CSI) and Performance Quality Index (PQI) for boot and in shortening of electrical cycles.
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