P. Schmidt, E. Barbier, P. Collot, D. Pons
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引用次数: 0

摘要

作者报告了一种伪晶半导体-绝缘体-半导体场效应晶体管(PM-SISFET),该晶体管使用未掺杂的薄层GaInAs代替GaAs作为沟道形成层。该器件由未掺杂的AlGaAs势垒层、重掺杂的n型GaAs栅极和上层GaInAs接触层组成。在这种结构下,器件具有自然的负阈值电压。这些结构采用分子束外延法生长。与传统的GaAs sisfet一样,该器件采用自对准离子注入和快速热退火(RTA)制备。对于In含量约为12%的120- aa厚的GaInAs通道层,在4.2 K下,生长层和RTA后的高分辨率光致发光光谱均为3.1 MeV。这些测量结果表明,在退火过程中,应变层没有发生结构退化。为了比较性能,作者还生长和加工了传统的GaAs/AlGaAs/n/sup +/-GaAs sisfet。在300 K时,1 μ m栅极长度器件的跨导率和漏极电流分别超过270 mS/mm和250 mA/mm,而类似的传统sisfet分别为240 mS/mm和200 mA/mm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A pseudomorphic GaAs/GaInAs/AlGaAs SISFET
The authors report a pseudomorphic semiconductor-insulator-semiconductor field-effect transistor (PM-SISFET) that uses a thin layer of undoped GaInAs instead of GaAs as the channel-forming layer. The device consists of an undoped AlGaAs barrier layer, a heavily doped n-type GaAs gate, and an upper GaInAs contact layer. With this structure, the device has a naturally negative threshold voltage. The structures were grown by molecular beam epitaxy. The devices were fabricated using, as for conventional GaAs SISFETs, self-aligned ion implantation and rapid thermal annealing (RTA). High-resolution photoluminescence spectra at 4.2 K for both the as-grown layer and after RTA have a FWHM (full width at half-maximum) of 3.1 MeV for a 120-AA-thick GaInAs channel layer with an In content of about 12%. These measurements indicate that no structural degradation of the strained layer occurred during annealing. To compare performance, the authors also grew and processed conventional GaAs/AlGaAs/n/sup +/-GaAs SISFETs. At 300 K, the 1- mu m-gate-length devices showed transconductances and drain currents in excess of 270 mS/mm and 250 mA/mm, respectively, for PM-SISFETs compared to 240 mS/mm and 200 mA/mm, respectively, for similar conventional SISFETs.<>
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