{"title":"接近闭锁条件的沟槽IGBT行为","authors":"A. Muller, F. Pfirsch, D. Silber","doi":"10.1109/ISPSD.2005.1487999","DOIUrl":null,"url":null,"abstract":"Trench IGBTs show very high stability against latching with appropriate layout of the p-body/trench distance. This is in accordance with the simulation results. Simulation of parallel devices resulted in unexpected alternating high current states indicating the possibility of moving filaments as has been reported from dynamic avalanche investigations","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":"{\"title\":\"Trench IGBT behaviour near to latch-up conditions\",\"authors\":\"A. Muller, F. Pfirsch, D. Silber\",\"doi\":\"10.1109/ISPSD.2005.1487999\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Trench IGBTs show very high stability against latching with appropriate layout of the p-body/trench distance. This is in accordance with the simulation results. Simulation of parallel devices resulted in unexpected alternating high current states indicating the possibility of moving filaments as has been reported from dynamic avalanche investigations\",\"PeriodicalId\":154808,\"journal\":{\"name\":\"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"21\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2005.1487999\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2005.1487999","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Trench IGBTs show very high stability against latching with appropriate layout of the p-body/trench distance. This is in accordance with the simulation results. Simulation of parallel devices resulted in unexpected alternating high current states indicating the possibility of moving filaments as has been reported from dynamic avalanche investigations