{"title":"电迁移诱发失效次数的概率分布模型","authors":"Michael Loupis, J. Avaritsiotis","doi":"10.1109/MELCON.1991.161826","DOIUrl":null,"url":null,"abstract":"It has been shown that life data from electromigration tests on TiW+Al/Cu bilayer interconnects, under four different ambient temperatures are better fitted to a log extreme value distribution than to a Weibull or a lognormal one. The combination of the authors' results with simulated life data modeling done by J.M. Schoen (1980) indicates the same trend. It is believed that the lognormal distribution, which has been extensively used in electromigration studies, may be an inaccurate model of the phenomenon.<<ETX>>","PeriodicalId":193917,"journal":{"name":"[1991 Proceedings] 6th Mediterranean Electrotechnical Conference","volume":"1629 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Probability distribution modelling of electromigration induced failure times\",\"authors\":\"Michael Loupis, J. Avaritsiotis\",\"doi\":\"10.1109/MELCON.1991.161826\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been shown that life data from electromigration tests on TiW+Al/Cu bilayer interconnects, under four different ambient temperatures are better fitted to a log extreme value distribution than to a Weibull or a lognormal one. The combination of the authors' results with simulated life data modeling done by J.M. Schoen (1980) indicates the same trend. It is believed that the lognormal distribution, which has been extensively used in electromigration studies, may be an inaccurate model of the phenomenon.<<ETX>>\",\"PeriodicalId\":193917,\"journal\":{\"name\":\"[1991 Proceedings] 6th Mediterranean Electrotechnical Conference\",\"volume\":\"1629 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991 Proceedings] 6th Mediterranean Electrotechnical Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MELCON.1991.161826\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991 Proceedings] 6th Mediterranean Electrotechnical Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MELCON.1991.161826","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Probability distribution modelling of electromigration induced failure times
It has been shown that life data from electromigration tests on TiW+Al/Cu bilayer interconnects, under four different ambient temperatures are better fitted to a log extreme value distribution than to a Weibull or a lognormal one. The combination of the authors' results with simulated life data modeling done by J.M. Schoen (1980) indicates the same trend. It is believed that the lognormal distribution, which has been extensively used in electromigration studies, may be an inaccurate model of the phenomenon.<>
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